ASI Releases Nobleflex Advanced Substrate Manufacturing Platform

American Semiconductor, Inc. (ASI), a U.S. based leader in advanced substrate manufacturing and microelectronic packaging, announced the release of its Nobleflex Au-on-Polyimide (Au-on-PI) high-density interconnect (HDI) flexible substrate manufacturing process. 

The release expands American Semiconductor’s growing portfolio of advanced substrate technologies and provides customers with a U.S.-based manufacturing capability for gold-based flexible substrates supporting next-generation semiconductor packaging and high-performance electronic systems.

Nobleflex is supported by American Semiconductor’s Substrate Design Kit (SDK), Multi-Project Substrate (MPS) program, prototype fabrication, and process customization services.

Together with the recent release of Ultraflex, Nobleflex gives designers complementary substrate platforms that enable material selection based on application requirements while maintaining access to domestic prototype and production manufacturing.

The Nobleflex process is available to support customer process development, prototype fabrication, and production programs requiring ultra-fine-feature gold interconnect technology. 

Built on a flexible polyimide architecture, Nobleflex incorporates dual gold interconnect layers, precision microvias, and minimum feature sizes down to 2 µm in an ultra-thin (~23 µm) substrate. 

The process delivers bend durability exceeding 1 million cycles at a 5 mm radius and reliable operation from -55°C to +150°C. These capabilities support advanced medical devices, implantable and wearable technologies, catheter-based electronics, aerospace and defense systems, research platforms, and next-generation semiconductor packaging. 

“The release of Nobleflex represents another important step in expanding our advanced packaging portfolio,” said Doug Hackler, CEO of American Semiconductor. “By offering both copper- and gold-based advanced substrate manufacturing platforms, we are providing our customers with greater design flexibility while strengthening domestic access to advanced microelectronics manufacturing capabilities.”